Multilayer printed circuit board and electronic device including the same

ABSTRACT

A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit under 35 U.S.C. § 119(a) of a Koreanpatent application filed on Dec. 16, 2016 in the Korean IntellectualProperty Office and assigned Serial number 10-2016-0173002, the entiredisclosure of which is hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to a multilayer printed circuit boardcapable of reducing loss in signal transmission and to an electronicdevice including the same.

BACKGROUND

To meet increasing demands for wireless data traffic aftercommercialization of the fourth generation (4G) communication system,efforts have been made to develop an improved fifth generation (5G) orpre-5G communication system. Therefore, the 5G or pre-5G communicationsystem is also called a Beyond 4G Network or a Post long-term evolution(LTE) System.

The 5G communication system is considered to be implemented in higherfrequency millimeter wave (mmWave) bands so as to accomplish higher datarates. To decrease propagation loss of the radio waves and increase thetransmission distance, various techniques such as beamforming, massivemultiple-input multiple-output (MIMO), full dimensional MIMO (FD-MIMO),array antenna, analog beamforming, and large scale antenna techniquesare being discussed in the 5G communication system.

Additionally, in the 5G communication system, development for systemnetwork improvement is underway based on an advanced small cell, a cloudradio access network (cloud RAN), a ultra-dense network,device-to-device (D2D) communication, wireless backhaul, a movingnetwork, cooperative communication, coordinated multi-points (CoMP),reception-end interference cancellation, and the like.

Further, in the 5G system, hybrid frequency shift keying (FSK) andquadrature amplitude modulation (QAM) modulation (FQAM) and slidingwindow superposition coding (SWSC) are being developed as an advancedcoding modulation (ACM) schemes, and filter bank multi carrier (FBMC),non-orthogonal multiple access (NOMA), and sparse code multiple access(SCMA) are also being developed as advanced access technologies.

Meanwhile, in the 5G system as described above, electronic devices andbase stations are confronted with an increasing complexity in an antennamodule. This results in an increase in a transmission line between theantenna module and a circuit board included in the electronic device forusing the 5G system. Therefore, there is a need for reducing a signalloss due to an increase in the transmission line.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present disclosure.

SUMMARY

Aspects of the present disclosure are to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below. Accordingly, an aspect of the presentdisclosure is to provide a multilayer printed circuit board for reducinga signal loss occurring in a transmission line connected to an antennamodule and an electronic device including the multilayer printed circuitboard.

In accordance with an aspect of the present disclosure, a multilayerprinted circuit board is provided. The multilayer printed circuit boardincludes a plurality of substrate layers formed in stack may comprise afirst substrate layer located on an outer side of the plurality ofsubstrate layers, a second substrate layer located on another outer sideof the plurality of substrate layers that is opposite to the firstsubstrate layer, and a transmission line, connecting a first point ofthe first substrate layer and a second point of the second substratelayer, which passes through the first and second substrate layers, andincludes a sub-transmission line disposed between and extended along atleast two adjacent substrate layers among the plurality of substratelayers.

In accordance with another aspect of the present disclosure, anelectronic device is provided. The electronic device includes amultilayer printed circuit board including a plurality of substratelayers formed in stack, and the multilayer printed circuit board mayinclude a first substrate layer located on an outer side of theplurality of substrate layers, a second substrate layer located onanother outer side of the plurality of substrate layers that is oppositeto the first substrate layer, and a transmission line, connecting afirst point of the first substrate layer and a second point of thesecond substrate layer, which passes through the first and secondsubstrate layers, and includes a sub-transmission line disposed betweenand extended along at least two adjacent substrate layers among theplurality of substrate layers.

In accordance with another aspect of the present disclosure, it ispossible to reduce a signal loss that occurs in the transmission linethat connects substrate elements and an antenna module. This reductionof signal loss may increase transmission power of a signal transmittedfrom the antenna module of the electronic device, thus ensuring thecoverage of a wide area even with a small number of base stations.Further, this technique is cost-effective.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a diagram illustrating a typical fifth generation (5G)communication system according to an embodiment of the presentdisclosure;

FIGS. 2A and 2B are diagrams illustrating a normal transmission line anda plurality of layers including the transmission line according tovarious embodiments of the present disclosure;

FIGS. 3A and 3B are diagrams illustrating a structure of a signaltransmission unit according to various embodiments of the presentdisclosure;

FIGS. 4A and 4B are diagrams illustrating a structure of a signaltransmission unit according to various embodiments of the presentdisclosure;

FIGS. 5A and 5B are diagrams illustrating a structure of a signaltransmission unit according to various embodiments of the presentdisclosure;

FIGS. 6A, 6B, 6C, and 6D are diagrams illustrating a structure of asignal transmission unit according to various embodiments of the presentdisclosure; and

FIG. 7 is a diagram illustrating a connection layout between substrateelements and an antenna module using a transmission line portion of amultilayer printed circuit board according to an embodiment of thepresent disclosure.

Throughout the drawings, it should be noted that like reference numbersare used to depict the same or similar elements, features, andstructures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the present disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thepresent disclosure. In addition, descriptions of well-known functionsand constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of the presentdisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of the presentdisclosure is provided for illustration purpose only and not for thepurpose of limiting the present disclosure as defined by the appendedclaims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

In describing the embodiments, descriptions of techniques which are wellknown in the art to which the present disclosure belongs and which arenot directly related to the present disclosure will not be described orillustrated in detail. This is to avoid obscuring the subject matter ofthe present disclosure.

For the same reason, some elements are exaggerated, omitted or shownschematically in the accompanying drawings. Also, the size of eachelement does not entirely reflect the actual size. In the drawings, thesame or corresponding elements are denoted by the same referencenumerals.

The advantages and features of the present disclosure and the manner ofachieving them will become apparent with reference to the embodimentsdescribed in detail below with reference to the accompanying drawings.The present disclosure may, however, be embodied in many different formsand should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of thedisclosure to those skilled in the art. To fully disclose the scope ofthe disclosure to those skilled in the art, and the disclosure is onlydefined by the scope of the claims.

It will be understood that each block of the flowchart illustrations,and combinations of blocks in the flowchart illustrations, may beimplemented by computer program instructions. These computer programinstructions may be provided to a processor of a general purposecomputer, special purpose computer, or other programmable dataprocessing apparatus to produce a machine, such that the instructions,which are executed via the processor of the computer or otherprogrammable data processing apparatus, generate means for implementingthe functions specified in the flowchart block or blocks. These computerprogram instructions may also be stored in a non-transitory computerusable or computer-readable memory that may direct a computer or otherprogrammable data processing apparatus to function in a particularmanner, such that the instructions stored in the non-transitory computerusable or computer-readable memory produce an article of manufactureincluding instruction means that implement the function specified in theflowchart block or blocks. The computer program instructions may also beloaded onto a computer or other programmable data processing apparatusto cause a series of operational steps to be performed on the computeror other programmable apparatus to produce a computer implementedprocess such that the instructions that are executed on the computer orother programmable apparatus provide steps for implementing thefunctions specified in the flowchart block or blocks.

And each block of the flowchart illustrations may represent a module,segment, or portion of code, which comprises one or more executableinstructions for implementing the specified logical function(s). Itshould also be noted that in some alternative implementations, thefunctions noted in the blocks may occur out of the order. For example,two blocks shown in succession may in fact be executed substantiallyconcurrently or the blocks may sometimes be executed in the reverseorder, depending upon the functionality involved.

The term “unit”, as used herein, may refer to a software or hardwarecomponent or device, such as a field programmable gate array (FPGA) orapplication specific integrated circuit (ASIC), which performs certaintasks. A unit may be configured to reside on an addressable storagemedium and configured to execute on one or more processors. Thus, a unitmay include, by way of example, components, such as software components,object-oriented software components, class components and taskcomponents, processes, functions, attributes, procedures, subroutines,segments of program code, drivers, firmware, microcode, circuitry, data,databases, data structures, tables, arrays, and variables. Thefunctionality provided for in the components and units may be combinedinto fewer components and units or further separated into additionalcomponents and units. In addition, the components and units may beimplemented to drive one or more central processing units (CPUs) in adevice or a secure multimedia card. Also, in embodiments, a unit mayinclude one or more processors.

An electronic device according to the present disclosure may include amobile terminal in general, and may indicate any device that hassubscribed to a mobile communication system and is to receive a servicefrom the mobile communication system. The mobile terminal may include asmart device such as a smart phone or a tablet PC, which is merelyexemplary and not to be construed as a limitation of the presentdisclosure.

FIG. 1 is a diagram illustrating a typical fifth generation (5G)communication system 100 according to an embodiment of the presentdisclosure.

Referring to FIG. 1, in order to allow the electronic devices (alsoreferred to as a terminal or a user equipment (UE)) 110 and 120 toperform stable mobile communication, a plurality of 5G base stations130, 140, 150, and 160 may be installed. For example, the 5Gcommunication system 100 may be designed, based on the antenna beamcoverage and the antenna radiation output such as equivalent isotropicradiated power (EIRP) of the base stations 130, 140, 150, and 160.

FIGS. 2A and 2B are diagrams illustrating a normal transmission line anda plurality of layers including the transmission line according tovarious embodiments of the present disclosure.

Referring to FIG. 2A a part of a substrate is included in the electronicdevice for performing wireless communication, namely, a part forconnecting an antenna module. For example, the substrate may be amultilayer printed circuit board (multilayer PCB) composed of aplurality of layers. In addition, the antenna module may be connected toan upper part of the multilayer PCB. FIG. 2A shows the upper part of themultilayer printed circuit board (PCB) connected to the antenna module.

Hereinafter, the upper part of the multilayer PCB connected to theantenna module as shown in FIG. 2A is defined as a signal transmissionunit 200, which is an element for connecting a chip, a processor, etc.included in the electronic device to the antenna module.

The signal transmission unit 200 may include a transmission line 210 forconnecting the substrate and the antenna module. The transmission line210 may be connected to the substrate including various elements of theelectronic device at a first point 211 and connected to the antennamodule at a second point 212. For example, a signal generated in theelectronic device may be transmitted to the antenna module via thetransmission line 210.

Although FIG. 2A merely shows one transmission line 210, the number oftransmission lines 210 may increase proportionally to the number ofantenna modules.

The transmission line 210 may be interposed between a plurality oflayers 230 and extended along a certain layer. In addition, thetransmission line 210 may be surrounded by ground layers 230-1 and230-2. The plurality of layers 220 forming the respective layers of PCBmay be implemented as prepreg (PPG).

The ground layers 230-1 and 230-2 may be formed on outer sides of theplurality of layers 220 in which the transmission line 210 isinterposed. FIG. 2A is a cross-sectional view of the signal transmissionunit 200. Therefore, although not shown in FIG. 2A, the ground layers230-1 and 230-2 may be formed in the vertical direction as well as inthe horizontal direction. For example, a certain ground layer (notshown) that connects the first ground layer 230-1 and the second groundlayer 230-2 of the ground layers 230-1 and 230-2 in a directionperpendicular to the plurality of layers 220 may be further formed.

FIG. 2B is a top view of the signal transmission unit 200 shown in FIG.2A.

Referring to FIG. 2B, the first ground layer 230-1 may be formed tosurround the transmission line 210 in a rectangular shape.

In the signal transmission unit 200 as shown in FIGS. 2A and 2B, thetransmission line 210 may be subjected to a signal loss. For example, ifthe transmission power of a transmission signal generated by theelectronic device is 10, the transmission power of the transmissionsignal transmitted to the antenna module may be reduced to 4 due to asignal loss that occurs during the transmission through the transmissionline 210. Since signals are transmitted with low transmission power, itis therefore beneficial to install a larger number of base stations.

In addition, the signal loss occurring in the transmission line isproportional to the length of the transmission line. As the number ofantenna modules used in the 5G communication system increases, thelength of the transmission line also increases. Therefore, in the 5Gcommunication system, the signal loss occurring in the transmission lineis further increased in comparison with the existing communicationsystem.

In addition, as described above, the 5G communication system performscommunication through a super high frequency band. In this super highfrequency band, the signal loss occurring in the transmission line mayincrease depending on the characteristics of materials of thetransmission line. Therefore, the transmission power of the electronicdevice may be greatly reduced due to an increase in the signal loss.

Hereinafter, a method according to the present disclosure for reducing asignal loss occurring in the transmission line will be described indetail. This technique may be advantageously applied to the 5Gcommunication system as described above. This is, however, exemplaryonly and not to be construed as a limitation. Additionally, thetechnique of the disclosure may be also applied to any communicationsystem before and after 5G.

FIGS. 3A and 3B are diagrams illustrating a structure of a signaltransmission unit 300 according to various embodiments of the presentdisclosure.

Referring to FIGS. 3A and 3B, the signal transmission unit 300 mayinclude a transmission line 310 that connects a substrate and an antennamodule, a plurality of layers 320 that is formed in stack, and a groundlayer 330 that is formed on outer sides of the plurality of layers 320and surrounds the transmission line 310.

The transmission line 310 may include a plurality of sub-transmissionlines. In other words, the transmission line 310 may be connected to thesubstrate at one starting point thereof and then separated into two ormore branches. Thereafter, the branches may be combined into onetransmission line, which may be connected to one antenna module.

Specifically, as shown in FIG. 3A, the transmission line 310 mayinclude, at a first point 311 connected to the substrate, a firstsub-transmission line 310-1 which is extended in a directionperpendicular to the plurality of layers 320.

In addition, the transmission line 310 may further include a secondsub-transmission line 310-2, a third sub-transmission line 310-3 and afourth sub-transmission line 310-4, which are connected to the firstsub-transmission line 310-1 at different points and respectivelyextended along the plurality of layers 320.

The second sub-transmission line 310-2, the third sub-transmission line310-3 and the fourth sub-transmission line 310-4 may be connected to afifth sub-transmission line 310-5 which is extended in a directionperpendicular to the plurality of layers 320 and connected to theantenna module at a second point 312.

The first to fifth sub-transmission lines 310-1, 310-2, 310-3, 310-4,and 310-5 may constitute one transmission line 310 as a whole.

When the signal transmission unit 300 is implemented as shown in FIG.3A, the transmission line 310 thereof may have a narrower width thanthat of the transmission line 210 included in the typical signaltransmission unit 200 as shown in FIG. 2A. For example, when the widthof the transmission line 210 included in the typical signal transmissionunit 200 as shown in FIG. 2A is 35 μm, the width of the transmissionline 310 included in the signal transmission unit 300 as shown in FIG.3A may be implemented as 5 μm.

As the width of the transmission line 310 is narrowed, it is possible tominiaturize the signal transmission unit 300.

Meanwhile, although FIG. 3A exemplarily shows three sub-transmissionlines 310-2, 310-3 and 310-4 extended along the plurality of layers 320,there are no restrictions on the number of sub-transmission lines aslong as the number is two or more.

FIG. 3B shows a modification in the signal transmission unit 300 shownin FIG. 3A. As shown in FIG. 3B, the transmission line 310 may include,at the first point 311 connected to the substrate, a firstsub-transmission line 310-1 which is extended in a directionperpendicular to the plurality of layers 320.

In addition, the transmission line 310 may further include a secondsub-transmission line 310-2 and a third sub-transmission line 310-3,which are connected to the first sub-transmission line 310-1 atdifferent points and respectively extended along the plurality of layers320.

The second sub-transmission line 310-2 and the third sub-transmissionline 310-3 may be connected to a fourth sub-transmission line 310-4which is extended in a direction perpendicular to the plurality oflayers 320 and connected to the antenna module at the second point 312.

The first to fourth sub-transmission lines 310-1, 310-2, 310-3, and310-4 may constitute one transmission line 310 as a whole.

FIGS. 4A and 4B are diagrams illustrating a structure of a signaltransmission unit 400 according to various embodiments of the presentdisclosure.

Referring to FIGS. 4A and 4B, the signal transmission unit 400 does notinclude a sub-transmission line extended along a plurality of layers.The signal transmission unit 400 is characterized by including two ormore layers above or under the transmission line extended along acertain layer.

Specifically, as shown in FIG. 4A, the transmission line 310 may beextended in a direction perpendicular to a first layer 421 at a firstpoint 411 connected to the substrate. A first ground layer 431 may bedisposed under the first layer 421.

In addition, the transmission line 410 may be extended along the firstlayer 421. For example, the transmission line 410 may be extendedbetween the first layer 421 and a second layer 422 which is disposedabove the first layer 421.

The transmission line 410 extended along the first layer 421 may befurther extended in a direction perpendicular to the second layer 422, athird layer 423, and a fourth layer 424. Then, the transmission line 410may be connected to the antenna module at a second point 412.

A second ground layer 432 may be disposed above the fourth layer 424.FIG. 4A is a cross-sectional view of the signal transmission unit 400.Therefore, although not shown in FIG. 4A, the ground layers 431 and 432may be formed in the vertical direction as well as in the horizontaldirection. For example, a plurality of ground lines (not shown) thatconnect the first ground layer 431 and the second ground layer 432 in adirection perpendicular to the plurality of layers 421, 422, 423, and424 may be further formed.

Meanwhile, FIG. 4B shows a modification in the signal transmission unit400 shown in FIG. 4A. As shown in FIG. 4B, the transmission line 410 maybe extended in a direction perpendicular to the first and second layers421 and 422 at the first point 411 connected to the substrate. The firstground layer 431 may be disposed under the first layer 421.

In addition, the transmission line 410 may be extended along the secondlayer 422. For example, the transmission line 410 may be extendedbetween the second layer 422 and the third layer 423 which is disposedabove the second layer 422.

The transmission line 410 extended along the second layer 422 may befurther extended in a direction perpendicular to the third and fourthlayers 423 and 424. Then, the transmission line 410 may be connected tothe antenna module at the second point 412.

The second ground layer 432 may be disposed above the fourth layer 424.FIG. 4B is a cross-sectional view of the signal transmission unit 400.Therefore, although not shown in FIG. 4B, the ground layers 431 and 432may be formed in the vertical direction as well as in the horizontaldirection. For example, a plurality of ground lines (not shown) thatconnect the first ground layer 431 and the second ground layer 432 in adirection perpendicular to the plurality of layers 421, 422, 423, and424 may be further formed.

Meanwhile, the transmission line 410 of the signal transmission unit 400shown in FIGS. 4A and 4B may be greater in width than the transmissionline 310 of the signal transmission unit 300 shown in FIGS. 3A and 3B.

According to still another embodiment, the transmission line may beseparated into a plurality of branches and be extended along a directionthat the plurality of layers extend.

FIG. 5A is a cross-sectional view of a signal transmission unit 500according to an embodiment of the present disclosure.

Referring to FIG. 5A, the signal transmission unit 500 may include atransmission line 510 for connecting the substrate and the antennamodule. The transmission line 510 may be connected to the substrateincluding various elements of the electronic device at a first point 511and connected to the antenna module at a second point 512.

The transmission line 510 may be interposed between a plurality oflayers 520 and extended along a certain layer. In addition, thetransmission line 510 may be surrounded by ground layers 531 and 532.The plurality of layers 520 forming the respective layers of PCB may beimplemented as PPG.

The ground layers 531 and 532 may be formed on outer sides of theplurality of layers 520 in which the transmission line 510 isinterposed. FIG. 2A is a cross-sectional view of the signal transmissionunit 500. Therefore, although not shown in FIG. 5A, the ground layers531 and 532 may be formed in the vertical direction as well as in thehorizontal direction. For example, a certain ground layer (not shown)that connects the first and second ground layers 531 and 532 in adirection perpendicular to the plurality of layers 520 may be furtherformed.

FIG. 5B is a top view of a portion 540 of the signal transmission unit500 shown in FIG. 5A according to an embodiment of the presentdisclosure.

Referring to FIG. 5B, the transmission line 510 may be separated into afirst sub-transmission line 510-1, a second sub-transmission line 510-2,and a third sub-transmission line 510-3 on the same layer, namely,between two adjacent layers.

Specifically, the transmission line 510 may be extended in a directionperpendicular to the plurality of layers at the first point 511connected to the substrate.

Then, the transmission line 510 may be separated into the firstsub-transmission line 510-1, the second sub-transmission line 510-2, andthe third sub-transmission line 510-3 interposed between and extendedalong two adjacent layers among the plurality of layers 520.

The first sub-transmission line 510-1, the second sub-transmission line510-2, and the third sub-transmission line 510-3 may be combined intoone transmission line again. Then, the combined transmission line may beextended in a direction perpendicular to the plurality of layers andconnected to the antenna module at the second point 512.

As shown in FIG. 5B, the first sub-transmission line 510-1, the secondsub-transmission line 510-2, and the third sub-transmission line 510-3may be connected to each other at certain points while being extended onthe same layer.

FIGS. 6A, 6B, 6C, 6D illustrate an embodiment including additionalground lines when the transmission line is extended along a plurality oflayers as described above according to various embodiments of thepresent disclosure.

Referring to FIGS. 6A and 6B show an embodiment in which an additionalground line 625 is added to the above-discussed embodiment of FIG. 3A.

Specifically, a signal transmission unit 600 may include a transmissionline 610 connected to the substrate and the antenna module. As describedabove, the transmission line 610 may refer to a path from one pointconnected to the substrate to another point connected to the antennamodule. Also, the transmission line 610 may be branched into a pluralityof sub-transmission lines respectively extended along a plurality oflayers 620.

Meanwhile, as described above, the transmission line 610 may besurrounded by ground layers 631 and 632. The ground layers 631 and 632may be formed on outer sides of the plurality of layers 620 in which thetransmission line 610 is interposed.

FIGS. 6A and 6B are cross-sectional views of the signal transmissionunit 600. Therefore, although not shown in FIGS. 6A and 6B, the groundlayers 631 and 632 may be formed in the vertical direction as well as inthe horizontal direction. For example, a certain ground layer (notshown) that connects the ground layers 631 and 632 in a directionperpendicular to the plurality of layers 620 may be further formed.

In addition, the signal transmission unit 600 may further include aground line 625 that surrounds the plurality of sub-transmission linesand extends in a direction perpendicular to the plurality of layers 620.The ground line 625 is not limited in number. Therefore, two groundlines 625 are possible as shown in FIG. 6A, and also a plurality ofground lines 625 are possible as shown in FIG. 6B.

Referring to FIGS. 6C and 6D show an embodiment in which the additionalground line 625 is added to the above-discussed embodiment of FIG. 3B.Therefore, the additional ground line(s) as shown in FIGS. 6A to 6D maybe added to embodiments in which the transmission line is branched intothe plurality of sub-transmission lines in the same direction as theplurality of layers.

With the addition of the additional ground line(s), any undesirable lossthat occurs in the transmission line during signal transmission may bereduced.

FIG. 7 shows an electronic device 700 including a substrate, an antenna,and a transmission line connecting the substrate and the antennaaccording to an embodiment of the present disclosure.

Referring to FIG. 7, the substrate may be a multilayer PCB composed of aplurality of layers. In addition, an antenna module 730 may be connectedto an upper part of the multilayer PCB.

A transmission line 710 connected to the antenna module 730 may be alsoconnected to a radio frequency integrated circuit (RFIC) 720 through themultilayer. For example, when a signal to be transmitted by theelectronic device is generated by the RFIC 720 or a signal generatorincluded in the RFIC 720, the transmission line 710 may transmit thetransmission signal to the antenna module 730.

The transmission line 710 may connect the RFIC 720 and the antennamodule 730 through a plurality of layers. The plurality of layers usedfor the transmission line 710 may be some layers disposed at an upperpart of the multilayer PCB.

The transmission line 710 may be surrounded by a ground layer 740. Theground layer 740 may be composed of a plurality of ground lines.

The electronic device 700 may include any type of the above-discussedsignal transmission unit as well as a specific type shown in FIG. 7. Theelectronic device 700 including the signal transmission unit mayminimize the loss of the generated signal and transmit the signal toanother device.

While the present disclosure has been shown and described with referenceto various embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the present disclosure asdefined by the appended claims and their equivalents.

What is claimed is:
 1. A multilayer printed circuit board including aplurality of substrate layers formed in a stack, the multilayer printedcircuit board comprising: a first substrate layer located on an outerside of the plurality of substrate layers; a second substrate layerlocated on another outer side of the plurality of substrate layers thatis opposite to the first substrate layer; and a transmission line,connecting a first point of the first substrate layer and a second pointof the second substrate layer, which passes through the first and secondsubstrate layers, and includes a sub-transmission line disposed betweenand extended along at least two adjacent substrate layers among theplurality of substrate layers.
 2. The multilayer printed circuit boardof claim 1, wherein the transmission line includes a plurality ofsub-transmission lines disposed between and extended along at leastthree adjacent substrate layers among the plurality of substrate layers.3. The multilayer printed circuit board of claim 1, wherein thesub-transmission line included in the transmission line is branchedbetween the at least two adjacent substrate layers.
 4. The multilayerprinted circuit board of claim 1, wherein the first point of the firstsubstrate layer is connected to a radio frequency integrated circuit,and wherein the second point of the second substrate layer is connectedto an antenna module.
 5. The multilayer printed circuit board of claim1, further comprising: a ground layer formed on at least one of thefirst or second substrate layers.
 6. The multilayer printed circuitboard of claim 5, further comprising: a ground line surrounding thesub-transmission line and formed in a direction perpendicular to the atleast two adjacent substrate layers.
 7. The multilayer printed circuitboard of claim 5, further comprising: at least one additional groundlayer formed between the at least two adjacent substrate layers and theat least one of the first or second substrate layers.
 8. The multilayerprinted circuit board of claim 7, wherein the sub-transmission lineincluded in the transmission line is branched between the at least twoadjacent substrate layers.
 9. An electronic device comprising: amultilayer printed circuit board including a plurality of substratelayers formed in stack, wherein the multilayer printed circuit boardincludes: a first substrate layer located on outer side of the pluralityof substrate layers; a second substrate layer located on another outerside of the plurality of substrate layers that is opposite to the firstsubstrate layer; and a transmission line, connecting a first point ofthe first substrate layer and a second point of the second substratelayer, which passes through the first and second substrate layers, andincludes a sub-transmission line disposed between and extended along atleast two adjacent substrate layers among the plurality of substratelayers.
 10. The electronic device of claim 9, wherein the transmissionline includes a plurality of sub-transmission lines disposed between andextended along at least three adjacent substrate layers among theplurality of substrate layers.
 11. The electronic device of claim 9,wherein the sub-transmission line included in the transmission line isbranched between the at least two adjacent substrate layers.
 12. Theelectronic device of claim 9, wherein the first point of the firstsubstrate layer is connected to a radio frequency integrated circuit,and wherein the second point of the second substrate layer is connectedto an antenna module.
 13. The electronic device of claim 9, furthercomprising: a ground layer formed on at least one of the first or secondsubstrate layers.
 14. The electronic device of claim 13, furthercomprising: a ground line surrounding the sub-transmission line andformed in a direction perpendicular to the at least two adjacentsubstrate layers.
 15. The electronic device of claim 13, furthercomprising: at least one additional ground layer formed between the atleast two adjacent substrate layers and the at least one of the first orsecond substrate layers.
 16. The electronic device of claim 15, whereinthe sub-transmission line included in the transmission line is branchedbetween the at least two adjacent substrate layers.